IC Resources
Principal Packaging Engineer
Requirements
Requires strong experience in advanced semiconductor packaging and heterogeneous integration, including 2.5D/3D packaging, chiplets, and advanced assembly, plus a track record leading packaging development projects. Candidates should understand the full packaging lifecycle and signal integrity, power integrity, and thermal management, and have experience delivering prototypes or demonstrators; AI, HPC, telecoms, or photonics experience is desirable.
Job Description
My client is looking for a Principal Packaging Engineer, focused on advanced packaging architecture, heterogeneous integration and next-generation semiconductor systems across AI, HPC, RF, power and photonics. This is an opportunity for an Engineer with a strong technical background, and leadership experience, looking to step into a Principal position.
Responsibilities
- Architect advanced 2.5D/3D packaging and heterogeneous integration solutions
- Lead chiplet, interposer, TSV, high-density interconnect and hybrid bonding development
- Take packaging concepts from customer requirements through prototyping, demonstrators and qualification
- Define packaging technology roadmaps and drive long-term innovation
- Lead multidisciplinary technical projects across design, assembly, thermal and test
- Develop advanced microelectronic modules and system demonstrators
- Provide technical leadership across design, validation and qualification
- Support hands-on prototyping and laboratory development
- Contribute to technical proposals, bids and collaborative R&D programmes
- Manage technical risks and support technology decisions with customers and partners
Requirements
- Strong experience in advanced semiconductor packaging and heterogeneous integration
- Expertise in 2.5D/3D packaging, chiplets and advanced assembly
- Experience with substrates, interposers, TSVs and/or hybrid bonding
- Proven experience leading semiconductor packaging development projects
- Understanding of the full packaging lifecycle from design through qualification
- Knowledge of signal integrity, power integrity and thermal management
- Experience taking R&D concepts through to working prototypes or demonstrators
- Strong technical leadership, problem-solving and communication skills
- Experience in AI, HPC, telecoms or photonics is desired but not a must
Benefits
- Competitive salary + bonus
- Sponsorship + Relocation assistance
- Company pension
- Private healthcare for you and your family
- Hybrid working to fit around your schedule
- A healthy work environment, with great work life balance
If you are interested, contact Ella Flynn at IC Resources.
Skills
About IC Resources
In the search for highly skilled talent, IC Resources has supported the technology community since 1999. We match great talent to deep-tech companies around the world. Founder-led and independent, IC Resources evolves with the industry, building extensive market knowledge and long-term relationships. IC Resources is viewed as a key contributor to the technology ecosystem. We’re one of the few recruitment companies that really pays it forward. Our 70 specialist recruitment consultants work to find the best long-term fit for individuals and organisations around the world. They work in dedicated teams within the Semiconductor, Electronics, Software, AI, Quantum and Photonics sectors, covering technical operations, sales and marketing, IT and executive positions. We’re embedded in the industries we work in, supporting our clients in seeking out the next generation of talented candidates, while building recruitment solutions that adapt to the different needs of individual organisations. If you’d like to discuss the employment marketplace, salary levels, your recruitment strategy or indeed your career, please contact us. T: +44 118 988 1150 W: ic-resources.com E: enquiry@ic-resources.com