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Plessey Semiconductors
Plessey Semiconductors

Senior Process Engineer - Coring

Plymouth On-site 5-10 yrs exp Appliances, Electrical, and Electronics Manufacturing 238 employees
Wafer CoringProcess OptimizationDOESPCFMEA
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Requirements

Requires a minimum of 5 years of experience in wafer pre-assembly or die preparation, with a preference for an HNC in Electrical, Electronic, or Mechanical Engineering. Must possess strong technical expertise in semiconductor process applications and data analysis methodologies like DOE and SPC.

Job Description

Senior Process Engineer - Coring

Department: Engineering

Employment Type: Full Time

Location: Plymouth



Description

As our Senior Process Engineer in Wafer Coring, you'll play a key role in developing and optimising wafer coring processes that support the manufacture of advanced semiconductor devices. You'll drive improvements in process capability, mechanical yield, wafer quality and production efficiency, helping to ensure robust and reliable manufacturing performance.

You'll have the opportunity to lead continuous improvement initiatives, tackle complex process
challenges and identify innovative solutions that enhance manufacturing capability. Working
closely with colleagues across Engineering, Production, Equipment and Quality, you'll help deliver stable, scalable and high-performing wafer coring operations while supporting the development of next-generation technologies.

We're looking for someone who combines strong technical expertise with a proactive, hands-on
approach to problem solving. If you're passionate about process optimisation, delivering measurable improvements and working with cutting-edge semiconductor technology, this is an
opportunity to make a real impact.

This role is primarily Monday to Friday, 8:00am to 4:30pm, with weekend support required on a rotating basis approximately once every three weeks. There may also be occasional requirements to work additional hours to support critical business needs and project deadlines.



Key Responsibilities

  • Own and maintain wafer coring processes performance, ensuring compliance with quality,
  • cost, throughput, and metrics targets.
  • Define and optimise process parameters, establish control plans, and maintain operating
  • specifications and procedures for wafer coring processes.
  • Initiate and drive continuous improvement programs focused on yield enhancement, cycle
  • time improvement, defect reduction, and cost optimisation.
  • Monitor process capability metrics, perform data analysis and implement improvement
  • actions to ensure robust process control.
  • Investigate technical and quality issues using structured problem-solving methodologies and provide timely engineering disposition.
  • Evaluate the processability of new products, device under development, and deliver sound process engineering recommendations.
  • Collaborate with equipment engineering and tool suppliers to improve equipment reliability, uptime, and performance.
  • Provide technical training and support to operations and engineering team.


Skills, Knowledge and Expertise

  • A minimum HNC in Electrical or Electronic or Mechanical Engineering is preferred or suitable experience.
  • Minimum 5 years of experience in wafer pre-assembly or die preparation processes. Wafer Coring experience or Equipment know-how is an advantage.
  • Hands-on process engineering experience on wafer Dicing, Backgrinding, Edge Grinding and Polishing, Laser Grooving and Marking processes.
  • In-depth knowledge and understanding on process application and material selection used in wafer Coring.
  • Strong understanding on DOE, SPC, FMEA, OCAP and data analysis methodologies.
  • Demonstrate continuous improvement mindset, high level of commitment, analytical and problem-solving skills.
  • Ability to multi-task, work in flexible assignments, and deliver effective result without close supervision.


Benefits

  • Pension scheme 
  • Private medical & dental insurance 
  • 28 days’ holiday + bank holidays 
  • Free onsite meals 
  • Onsite gym 
  • Relocation support 
  • Visa support available

Education

Professional Certificate

Skills

Wafer CoringProcess OptimizationDOESPCFMEAOCAPData AnalysisWafer DicingBackgrindingEdge GrindingPolishingLaser GroovingLaser MarkingYield EnhancementProblem SolvingProcess Control

About Plessey Semiconductors

Plessey is an award-winning leading developer of advanced optoelectronic technology solutions. The company provides volume processing of its unique and proprietary GaN-on-Silicon platform in a monolithic process for a wide range of microLED display technology solutions. With headquarters located in Plymouth, England, Plessey operates leading-edge 150mm and 200mm wafer processing facilities to undertake design, test and assembly of products, and a comprehensive suite of photonic characterisation and applications laboratories. Careers: We are embarking on some major projects with leading blue chip companies across the globe and are looking to expand our Plessey engineering talent pool and other key disciplines. For more information about life at Plessey and our careers, visit: http://www.plesseysemi.com/careers/

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